Benefits
? Minimum peak temperature 229?C
? Wide reflow process window
? Consistent fine pitch print deposition
? Excellent start-up after idle time
? Long stable tack life and open time
Introduction
NC-SMQ?230 is an air reflow, no-clean solder paste
specifically formulated to accommodate the higher
processing temperatures required by the SnAgCu,
SnAgBi, SnAg, and other Pb-free alloy systems favored
by the electronics industry to replace conventional
Pb-bearing solders. NC-SMQ?230 offers consistent,
repeatable printing performance combined with long
stencil and tack times to handle the rigors of today’s
high-speed as well as high-mix surface mount lines.
Packaging
Standard packaging for stencil printing applications includes
4 oz. jars and 6 oz. or 12 oz. cartridges. Packaging for
enclosed print head systems is also readily available.
For dispensing applications, 10cc and 30cc syringes are
standard. Other packaging options may be available upon
request.
Storage and Handling Procedures
Refrigerated storage will prolong the shelf life of solder paste.
The shelf life of NC-SMQ?230 is 6 months when stored
at <10?C. The shelf life at room temperature (<25?C) is
72 hours (3 days). Solder paste packaged in syringes and
cartridges should be stored tip down.
Solder paste should be allowed to reach ambient working
temperature prior to use. Generally, paste should be removed
from refrigeration at least two hours before use. Actual time
to reach thermal equilibrium will vary with container size.
Paste temperature should be verified before use. Jars and
cartridges should be labeled with date and time of opening.
